A foup (front opening unified pod) is a closed container used in the semiconductor manufacturing process, and is a system for safely storing and transporting wafers. A Foup is a transport container for 300mm wafers that complies with Semi (Semiconductor Equipment and Materials Institute) standards, and has the same level of storage capacity as the mini-environment system. Foup is an abbreviation for front opening unified pod, and it is an essential device in the semiconductor manufacturing process. The foup protects and cleans the wafer.
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Foup is an abbreviation for front opening unified pod, which is a box used to transport and load 300mm wafers into the equipment. The wafer holding mechanism is weaker than the FOSB mentioned above, and the wafer cannot be held.
